Invention Grant
- Patent Title: Thermally conductive composites and method of preparing same
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Application No.: US15620820Application Date: 2017-06-12
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Publication No.: US10385250B2Publication Date: 2019-08-20
- Inventor: Haojun Zhu , Changbao Ren , Lai To Leung , Kwok Keung Paul Ho
- Applicant: Nano and Advanced Materials Institute Limited
- Applicant Address: HK Hong Kong
- Assignee: Nano and Advanced Materials Institute Limited
- Current Assignee: Nano and Advanced Materials Institute Limited
- Current Assignee Address: HK Hong Kong
- Main IPC: C09K5/14
- IPC: C09K5/14 ; C08K3/04 ; C08K3/34 ; C08K7/00 ; C08K7/18

Abstract:
A method of preparing a thermally conductive composite including: a) mixing 15% to 60% by weight of a polymer matrix with 0% to 85% by weight of a high-aspect-ratio thermally conductive filler having an aspect ratio of at least 5:1; and (b) mixing a polymer melt obtained from step (a) with 0% to 85% by weight of a low-aspect-ratio thermally conductive filler having an aspect ratio of 2:1 or less. By changing the weight ratio, the structure and mechanical properties of the low-aspect-ratio thermally conductive filler and the high-aspect-ratio thermally conductive filler, thermal conductivity anisotropy can be tuned. A thermally conductive composite having thermal conductivity anisotropy in the range from 1 to 4 is also disclosed.
Public/Granted literature
- US20170355894A1 THERMALLY CONDUCTIVE COMPOSITES AND METHOD OF PREPARING SAME Public/Granted day:2017-12-14
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