Invention Grant
- Patent Title: Ceramic multilayer substrate
-
Application No.: US15918253Application Date: 2018-03-12
-
Publication No.: US10390426B2Publication Date: 2019-08-20
- Inventor: Masaaki Hanao , Tsuyoshi Katsube , Kazuo Kishida
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2015-185637 20150918
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/11 ; H05K3/00 ; H05K3/40 ; H05K3/46 ; G01R31/28

Abstract:
A ceramic multilayer substrate that includes a ceramic insulator layer, which includes a first layer, a second layer, and a third layer and in which the first layer is interposed between the second layer and the third layer, an inner pattern conductor, an outer pattern conductor, and outer electrodes. The ceramic insulator layer is interposed between the inner pattern conductor and the outer pattern conductor. The sintering shrinkage start temperatures of the second layer alone and the third layer alone in a green sheet state are higher than or equal to the sintering shrinkage stop temperature of the first layer alone in a green sheet state. The thickness of the ceramic insulator layer is 5.0 μm to 55.7 μm. The ratio of the total of the thickness of the second layer and the thickness of the third layer to the thickness of the first layer is 0.25 to 1.11.
Public/Granted literature
- US10426027B2 Ceramic multilayer substrate Public/Granted day:2019-09-24
Information query