Invention Grant
- Patent Title: Laminated scintillator panel
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Application No.: US15628781Application Date: 2017-06-21
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Publication No.: US10393888B2Publication Date: 2019-08-27
- Inventor: Hiromichi Shindou , Tadashi Arimoto
- Applicant: Konica Minolta, Inc.
- Applicant Address: JP Tokyo
- Assignee: Konica Minolta, Inc.
- Current Assignee: Konica Minolta, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Baker Hostetler
- Priority: JP2016-123364 20160622
- Main IPC: G01T1/20
- IPC: G01T1/20

Abstract:
Provided is a method of manufacturing a laminated scintillator panel having a structure in which a scintillator layer and a non-scintillator layer are repeatedly laminated in a parallel direction perpendicular to incidence of radiation, characterized by including a step of joining the scintillator layer and the non-scintillator layer. The present invention provides a method of manufacturing a lattice-shaped laminated scintillator panel capable of enlarging the area and increasing the thickness with means completely different from a prior art in which a silicon wafer is used.
Public/Granted literature
- US20170371045A1 Laminated Scintillator Panel Public/Granted day:2017-12-28
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