Invention Grant
- Patent Title: Reflective mask blank, reflective mask and method of manufacturing semiconductor device
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Application No.: US15539263Application Date: 2015-12-15
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Publication No.: US10394113B2Publication Date: 2019-08-27
- Inventor: Kazuhiro Hamamoto , Yohei Ikebe
- Applicant: HOYA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2014-260280 20141224
- International Application: PCT/JP2015/085020 WO 20151215
- International Announcement: WO2016/104239 WO 20160630
- Main IPC: G03F1/24
- IPC: G03F1/24 ; G03F1/32 ; G03F1/48 ; C03C3/06 ; C03C15/00 ; C03C17/34 ; C03C17/36 ; C03C23/00

Abstract:
An object of the present invention is to obtain a reflective mask blank capable of obtaining high contrast at the edges of a phase shift film pattern. Provided is a reflective mask blank comprising a multilayer reflective film and a phase shift film that shifts the phase of EUV light formed in that order on a substrate, wherein root mean square roughness (Rms), obtained by measuring a 1 μm×1 μm region on the surface of the phase shift film with an atomic force microscope, is not more than 0.50 nm, and power spectrum density at a spatial frequency of 10 to 100 μm−1 is not more than 17 nm4.
Public/Granted literature
- US20180329285A1 REFLECTIVE MASK BLANK, REFLECTIVE MASK AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2018-11-15
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