• Patent Title: Wiring body, wiring board, and touch sensor
  • Application No.: US15739109
    Application Date: 2016-06-22
  • Publication No.: US10394401B2
    Publication Date: 2019-08-27
  • Inventor: Tetsu Hammura
  • Applicant: FUJIKURA LTD.
  • Applicant Address: JP Tokyo
  • Assignee: FUJIKURA LTD.
  • Current Assignee: FUJIKURA LTD.
  • Current Assignee Address: JP Tokyo
  • Agency: Osha Liang LLP
  • Priority: JP2015-124738 20150622; JP2015-152536 20150731
  • International Application: PCT/JP2016/068554 WO 20160622
  • International Announcement: WO2016/208636 WO 20161229
  • Main IPC: G06F3/044
  • IPC: G06F3/044 G06F3/041
Wiring body, wiring board, and touch sensor
Abstract:
A wiring body includes: a first resin layer; an electrode layer on the first resin layer and formed by first conductor lines; a first lead wire layer on the first resin layer and formed by second conductor lines; and a boundary line interposed between the electrode layer and the first lead wire layer. The wiring body satisfies W1 W3 where W1 represents a width of the first conductor lines in a direction orthogonal to an extending direction of the first conductor lines, W2 represents a width of the second conductor lines in a direction orthogonal to an extending direction of the second conductor lines, L1 represents a length of the boundary line in its extending direction, and W3 represents a width of the one end part of the first lead wire layer in a direction orthogonal to an extending direction of the first lead wire layer.
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