Invention Grant
- Patent Title: Wiring body, wiring board, and touch sensor
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Application No.: US15739109Application Date: 2016-06-22
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Publication No.: US10394401B2Publication Date: 2019-08-27
- Inventor: Tetsu Hammura
- Applicant: FUJIKURA LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJIKURA LTD.
- Current Assignee: FUJIKURA LTD.
- Current Assignee Address: JP Tokyo
- Agency: Osha Liang LLP
- Priority: JP2015-124738 20150622; JP2015-152536 20150731
- International Application: PCT/JP2016/068554 WO 20160622
- International Announcement: WO2016/208636 WO 20161229
- Main IPC: G06F3/044
- IPC: G06F3/044 ; G06F3/041

Abstract:
A wiring body includes: a first resin layer; an electrode layer on the first resin layer and formed by first conductor lines; a first lead wire layer on the first resin layer and formed by second conductor lines; and a boundary line interposed between the electrode layer and the first lead wire layer. The wiring body satisfies W1 W3 where W1 represents a width of the first conductor lines in a direction orthogonal to an extending direction of the first conductor lines, W2 represents a width of the second conductor lines in a direction orthogonal to an extending direction of the second conductor lines, L1 represents a length of the boundary line in its extending direction, and W3 represents a width of the one end part of the first lead wire layer in a direction orthogonal to an extending direction of the first lead wire layer.
Public/Granted literature
- US20180181234A1 WIRING BODY, WIRING BOARD, AND TOUCH SENSOR Public/Granted day:2018-06-28
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