Invention Grant
- Patent Title: Method of etching microelectronic mechanical system features in a silicon wafer
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Application No.: US15919889Application Date: 2018-03-13
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Publication No.: US10395940B1Publication Date: 2019-08-27
- Inventor: Feng Zhou , Ki Wook Jung , Ercan Mehmet Dede , Mehdi Asheghi , Kenneth E. Goodson
- Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. , The Board of Trustees of the Leland Stanford Junior University
- Applicant Address: US TX Plano US CA Stanford
- Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.,The Board of Trustees of the Leland Stanford Junior University
- Current Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.,The Board of Trustees of the Leland Stanford Junior University
- Current Assignee Address: US TX Plano US CA Stanford
- Agency: Dinsmore & Shohl, LLP
- Main IPC: H01L21/308
- IPC: H01L21/308 ; B81C1/00
Abstract:
A method of etching features in a silicon wafer includes coating a top surface and a bottom surface of the silicon wafer with a mask layer having a lower etch rate than an etch rate of the silicon wafer, removing one or more portions of the mask layer to form a mask pattern in the mask layer on the top surface and the bottom surface of the silicon wafer, etching one or more top surface features into the top surface of the silicon wafer through the mask pattern to a depth plane located between the top surface and the bottom surface of the silicon wafer at a depth from the top surface, coating the top surface and the one or more top surface features with a metallic coating, and etching one or more bottom surface features into the bottom surface of the silicon wafer through the mask pattern to the target depth plane.
Public/Granted literature
- US20190287810A1 METHOD OF ETCHING MICROELECTRONIC MECHANICAL SYSTEM FEATURES IN A SILICON WAFER Public/Granted day:2019-09-19
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