Invention Grant
- Patent Title: Offset test pads for WLCSP final test
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Application No.: US15737470Application Date: 2016-08-15
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Publication No.: US10396001B2Publication Date: 2019-08-27
- Inventor: Bard M. Pedersen
- Applicant: Adesto Technologies Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Adesto Technologies Corporation
- Current Assignee: Adesto Technologies Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Michael C. Stephens, Jr.
- International Application: PCT/US2016/046968 WO 20160815
- International Announcement: WO2017/031027 WO 20170223
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H01L21/66 ; H01L23/00 ; H01L23/12 ; H01L23/31 ; H01L23/50 ; H01L23/498
Abstract:
A device configured for WLCSP, can include: a first pad; a test pad offset from the first pad; a first RDL path that connects the first pad to the test pad; and a second RDL path that connects the test pad to a solder ball. In another case, a device configured for WLCSP can include: a first pad; a test pad offset from the first pad; a first RDL path that connects the first pad to a solder ball; and a second RDL path that connects the test pad to the solder ball. A wafer having devices configured for WLCSP, can include: a first device having a first pad; a second device having a test pad; a first RDL path that connects the first pad to a solder ball; and a second RDL path that connects the test pad to the solder ball.
Public/Granted literature
- US20190006249A1 OFFSET TEST PADS FOR WLCSP FINAL TEST Public/Granted day:2019-01-03
Information query
