Invention Grant
- Patent Title: Electronic component storage substrate and housing package
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Application No.: US15560426Application Date: 2016-03-17
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Publication No.: US10396002B2Publication Date: 2019-08-27
- Inventor: Sentaro Yamamoto , Youji Furukubo , Masanori Okamoto , Yuhei Matsumoto
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto-Shi, Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto-Shi, Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2015-061089 20150324
- International Application: PCT/JP2016/058548 WO 20160317
- International Announcement: WO2016/152733 WO 20160929
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/08 ; H01L21/48 ; H01L23/057 ; H03H9/17 ; H03H9/10 ; H01L23/053 ; H01L41/053
Abstract:
The present invention includes: a substrate 3, a rectangular frame-shaped substrate bank section 5 provided on the substrate 3 and including four corner portions 5A, and a metal layer 9 provided on a top surface 5Aa of the substrate bank section 5. A top surface 5Aa of the corner portions 5A of the substrate bank section 5 may have an inclined portion S slanted downward. An electronic component housing package may have a lid welded onto the metal layer 9 provided on the substrate bank section 5 of the electronic component storage substrate.
Public/Granted literature
- US20180090405A1 ELECTRONIC COMPONENT STORAGE SUBSTRATE AND HOUSING PACKAGE Public/Granted day:2018-03-29
Information query
IPC分类:
