Invention Grant
- Patent Title: Substrate assembly with magnetic feature
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Application No.: US15859316Application Date: 2017-12-29
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Publication No.: US10396046B2Publication Date: 2019-08-27
- Inventor: Yikang Deng , Robert Sankman
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01F27/00
- IPC: H01F27/00 ; H01L23/64 ; H01L23/00 ; H01F27/28 ; H05K1/02

Abstract:
Apparatuses, systems and methods associated with substrate design with a magnetic feature for fully integrated voltage regulator are disclosed herein. In embodiments, a substrate assembly may include a base substrate and one or more interconnect elements located at a first side of the base substrate, the one or more interconnect elements to be coupled to a semiconductor chip having an integrated voltage regulator (IVR). The substrate assembly may further include a magnetic feature located at a second side of the base substrate, the second side being opposite to the first side, wherein the magnetic feature extends along a portion of the second side of the base substrate that is opposite to where the IVR is to be located when the semiconductor chip is coupled to the one or more interconnect elements. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20190206814A1 SUBSTRATE ASSEMBLY WITH MAGNETIC FEATURE Public/Granted day:2019-07-04
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F27/00 | 变压器或电感器的一般零部件 |