Embodiments of the present disclosure provide a semiconductor package configured to provide for a disposition of one or more package components on a substrate within a footprint of a package die. In embodiments, the package may include a package substrate having a first side and a second side opposite the first side. An area of the first side of the package substrate within which a die is to be disposed may form a footprint of the die on the substrate. The package may further include a voltage reference plane coupled with the second side of the package substrate. At least a portion of the voltage reference plane may be disposed within the die footprint, to provide a reference voltage to components to be disposed within the footprint on the second side of the substrate, and to shield these components from electromagnetic interference. Other embodiments may be described and/or claimed.