Invention Grant
- Patent Title: Very narrow aspect ratio trapping trench structure with smooth trench sidewalls
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Application No.: US15583293Application Date: 2017-05-01
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Publication No.: US10396075B2Publication Date: 2019-08-27
- Inventor: Karthik Balakrishnan , Kangguo Cheng , Pouya Hashemi , Alexander Reznicek
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent L. Jeffrey Kelly, Esq.
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/06 ; H01L21/8234 ; H01L21/02 ; H01L21/308

Abstract:
After forming a plurality of semiconductor fins that are separated from one another by trenches on a substrate, the semiconductor fins are fully or partially oxidized to provide semiconductor oxide portions. The volume expansion caused by the oxidation of the semiconductor fins reduces widths of the trenches, thereby providing narrowed trenches for formation of epitaxial semiconductor fins using aspect ratio trapping techniques.
Public/Granted literature
- US20180315753A1 VERY NARROW ASPECT RATIO TRAPPING TRENCH STRUCTURE WITH SMOOTH TRENCH SIDEWALLS Public/Granted day:2018-11-01
Information query
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