- Patent Title: Method for forming apparatus comprising two dimensional material
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Application No.: US15754460Application Date: 2016-08-25
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Publication No.: US10396180B2Publication Date: 2019-08-27
- Inventor: Adam Robinson , Darryl Cotton , Alexander Bessonov , Richard White , Yinglin Liu
- Applicant: EMBERION OY
- Applicant Address: FI Espoo
- Assignee: EMBERION OY
- Current Assignee: EMBERION OY
- Current Assignee Address: FI Espoo
- Agency: Squire Patton Boggs (US) LLP
- Priority: EP15182390 20150825
- International Application: PCT/EP2016/070124 WO 20160825
- International Announcement: WO2017/032850 WO 20170302
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/66 ; H01L29/778 ; H01L31/028 ; H01L31/0352 ; H01L31/113 ; H01L29/16 ; H01L29/423 ; G01N27/414

Abstract:
A method and apparatus, the method comprising: forming at least two electrodes (23) on a release layer wherein the at least two electrodes are configured to enable a layer of two dimensional material (25) to be provided between the at least two electrodes; providing moldable polymer (27) overlaying the at least two electrodes; wherein the at least two electrodes and the moldable polymer form at least part of a planar surface (29).
Public/Granted literature
- US20180248019A1 A METHOD FOR FORMING APPARATUS COMPRISING TWO DIMENSIONAL MATERIAL Public/Granted day:2018-08-30
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