Invention Grant
- Patent Title: Light emitting device and substrate
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Application No.: US15826455Application Date: 2017-11-29
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Publication No.: US10396262B2Publication Date: 2019-08-27
- Inventor: Seiji Nagahara , Kazuma Kozuru
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2016-233553 20161130; JP2017-219732 20171115
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H05K1/18 ; F21V23/00 ; H01L27/15 ; H05K1/02 ; F21V19/00 ; H01L33/32 ; H01L33/40 ; H01L25/075 ; H01L25/065 ; F21K9/238 ; H05K3/22 ; F21Y113/13 ; F21Y115/10 ; H05K1/11

Abstract:
A substrate for a light emitting device includes: a plurality of wiring patterns, each including: a first conductive pattern including: a light emitting element mounting region defined by a first, second, third, and fourth sides in a plan view, and a contact region; and a second conductive pattern surrounding a portion of the first side where the contact region is not present, an entirety of the second side, and a portion of or an entirety of the third side, wherein a first end portion of the second conductive pattern at the third side is positioned nearer to the fourth side than a second end portion of the second conductive pattern at the first side is to the fourth side. The third side of a second wiring pattern faces the first side of a first wiring pattern.
Public/Granted literature
- US20180151788A1 LIGHT EMITTING DEVICE AND SUBSTRATE Public/Granted day:2018-05-31
Information query
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