Invention Grant
- Patent Title: Piezoelectric element, method of forming piezoelectric element, and ultrasonic device
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Application No.: US15353854Application Date: 2016-11-17
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Publication No.: US10396271B2Publication Date: 2019-08-27
- Inventor: Hiroshi Matsuda
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2015-232820 20151130
- Main IPC: H01L41/047
- IPC: H01L41/047 ; H01L41/09 ; H01L41/27 ; B06B1/06 ; H01L41/08 ; H01L41/29 ; H01L41/332

Abstract:
A piezoelectric element includes a piezoelectric body that is provided on a substrate and includes multiple sides; a first wiring that is provided from the piezoelectric body to the substrate; and a second wiring that is provided from the piezoelectric body to the substrate. When the piezoelectric element is viewed from a thickness direction of the piezoelectric body, a second side and a fourth side on which the piezoelectric body is superimposed on the first wiring are different from a first side and a third side on which the second wiring is superimposed on the piezoelectric body.
Public/Granted literature
- US20170155030A1 PIEZOELECTRIC ELEMENT, METHOD OF FORMING PIEZOELECTRIC ELEMENT, AND ULTRASONIC DEVICE Public/Granted day:2017-06-01
Information query
IPC分类: