Invention Grant
- Patent Title: Elastic wave device, high-frequency front end circuit, and communication apparatus
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Application No.: US15633882Application Date: 2017-06-27
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Publication No.: US10396758B2Publication Date: 2019-08-27
- Inventor: Mari Saji
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2016-186971 20160926
- Main IPC: H04B1/10
- IPC: H04B1/10 ; H03H9/64 ; H03H7/38 ; H03H9/02 ; H03H9/145 ; H03H9/72

Abstract:
An elastic wave device includes a piezoelectric substrate that includes first and second main surfaces which face each other, an interdigital transducer electrode that is provided on the first main surface of the piezoelectric substrate and includes a first electrode layer containing molybdenum as a main component, and a dielectric film that is provided on the piezoelectric substrate and covers the interdigital transducer electrode. The piezoelectric substrate is made of lithium niobate. The dielectric film is made of silicon oxide. The elastic wave device utilizes Rayleigh waves propagating through the piezoelectric substrate. The duty ratio of the interdigital transducer electrode is equal to or more than about 0.55 and less than or equal to about 0.75.
Public/Granted literature
- US20180091118A1 ELASTIC WAVE DEVICE, HIGH-FREQUENCY FRONT END CIRCUIT, AND COMMUNICATION APPARATUS Public/Granted day:2018-03-29
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