Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15754553Application Date: 2015-09-02
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Publication No.: US10396856B2Publication Date: 2019-08-27
- Inventor: Motoaki Saito
- Applicant: PEZY Computing K.K.
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: PEZY COMPUTING K.K.
- Current Assignee: PEZY COMPUTING K.K.
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- International Application: PCT/JP2015/074915 WO 20150902
- International Announcement: WO2017/037883 WO 20170309
- Main IPC: H04B5/00
- IPC: H04B5/00 ; G06N3/063 ; H01L21/822 ; H01L27/04 ; H01F5/00 ; H01L23/64

Abstract:
A semiconductor device includes a first semiconductor chip and a second semiconductor chip The first semiconductor chip includes a transmission circuit input unit, a transmission circuit unit, and a transmission unit. The second semiconductor chip includes a reception unit, a reception circuit unit, and a reception circuit output unit. The transmission unit and the reception unit can communicate with each other in a non-contact manner. A transmission circuit unit input signal having a predetermined transmission-side potential is input into the transmission circuit unit. A reception circuit unit input signal is input into the reception circuit unit via the non-contact communication between the transmission unit and the reception unit. The reception circuit unit outputs a reception circuit unit output signal having a predetermined reception-side potential. The ratio of the reception-side potential to the transmission-side potential can be changed.
Public/Granted literature
- US20180248585A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-08-30
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