Invention Grant
- Patent Title: Optical module and optical transmitting apparatus installing a number of optical modules
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Application No.: US15800255Application Date: 2017-11-01
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Publication No.: US10396898B2Publication Date: 2019-08-27
- Inventor: Shuichi Kubota , Masahiro Hirayama
- Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Applicant Address: JP Yokohama-shi
- Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Current Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Current Assignee Address: JP Yokohama-shi
- Agency: Baker Botts LLP
- Agent Michael A. Satori
- Priority: JP2016-214464 20161101
- Main IPC: H04B10/04
- IPC: H04B10/04 ; H04B10/516 ; G02B19/00 ; G02B27/28 ; G02B27/30 ; H01S5/022 ; H01S5/068 ; H01S5/00 ; H01S5/042 ; G02B6/42

Abstract:
An optical module installed within an optical transmitter apparatus is disclosed. The optical module provides an electrically insulating carrier, a semiconductor element, and a capacitor. The carrier provides a ground pattern and a bias pad. The ground pattern mounts the capacitor and the semiconductor element thereon. The bias pad is electrically isolated from the ground pattern thereby forming a parasitic capacitor against the ground pattern. The optical module further includes at least two bonding wires among a first bonding wire connecting the semiconductor element with the bias pad, a second bonding wire connecting the bias pad with the capacitor, and an additional bonding wire connecting the capacitor with the semiconductor element. The semiconductor element is supplied with a bias current through the at least two bonding wires.
Public/Granted literature
- US20180123697A1 OPTICAL MODULE AND OPTICAL TRANSMITTING APPARATUS INSTALLING A NUMBER OF OPTICAL MODULES Public/Granted day:2018-05-03
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