Invention Grant
- Patent Title: Multi-chip structure having flexible input/output chips
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Application No.: US15050473Application Date: 2016-02-23
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Publication No.: US10397142B2Publication Date: 2019-08-27
- Inventor: Yan-Bin Luo , Hao-Hui Yin , Chih-Ching Yu , Yao-Chun Su
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H03M9/00
- IPC: H03M9/00 ; H04L12/931 ; H04L12/935 ; H01L25/065 ; H01L25/18

Abstract:
A multi-chip structure comprises a switch system on chip (switch SOC), a plurality of serializer/deserializer (SerDes) chips positioned around the switch SOC, and a plurality of inter-chip interfaces for connecting the switch SOC to the plurality of SerDes chips, respectively.
Public/Granted literature
- US20170054656A1 MULTI-CHIP STRUCTURE HAVING FLEXIBLE INPUT/OUTPUT CHIPS Public/Granted day:2017-02-23
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