Invention Grant
- Patent Title: Earphone
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Application No.: US15580609Application Date: 2016-06-08
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Publication No.: US10397685B2Publication Date: 2019-08-27
- Inventor: Kenji Ogata , Akihiko Hosaka , Yoshiyuki Watanabe
- Applicant: DAI-ICHI SEIKO CO., LTD.
- Applicant Address: JP Kyoto-Shi, Kyoto
- Assignee: DAI-ICHI SEIKO CO., LTD.
- Current Assignee: DAI-ICHI SEIKO CO., LTD.
- Current Assignee Address: JP Kyoto-Shi, Kyoto
- Agency: Howard & Howard Attorneys PLLC
- Priority: JP2015-122034 20150617
- International Application: PCT/JP2016/067087 WO 20160608
- International Announcement: WO2016/204045 WO 20161222
- Main IPC: H04R17/00
- IPC: H04R17/00 ; H04R1/10 ; H04R1/28

Abstract:
An earphone (1) is provided that includes a first vibration plate (31) for vibration by a first piezoelectric element (32) and a cylindrically-shaped casing (2) for transmission of the vibration of the first vibration plate (31) to ear canal cartilage. The first vibration plate (31) is disposed inside the casing (2). The earphone (1) has a structure whereby an amount of sound leakage, which is due to transmission of the vibration of the first vibration plate (31) to the air, is low. The ear canal cartilage transmits sound to the eardrum of only one ear, thereby enabling localization of sound. The woofer (3) maintains sound pressure at low frequencies.
Public/Granted literature
- US20180160209A1 EARPHONE Public/Granted day:2018-06-07
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