The wire saw device includes at least one wire, which is provided tightly to be capable of travelling in a direction crossing a workpiece to be cut, a workpiece holder, which is configured to hold the workpiece and to move the workpiece relative to the wire, slurry suppliers, which are configured to supply slurry to cut the workpiece from an upstream side in a travelling direction of the wire, and slurry collectors, which are configured to collect the slurry scattered due to contact with the workpiece. The slurry collector is configured to be movable in conjunction with the workpiece in the state where the slurry collector is disposed adjacent to the workpiece and also configured to be retractable with respect to the workpiece to be prevented from contacting the wire.