A three dimensional (3D) printer and method for dispensing a material to form a 3D substructure and for dispensing an adhesive onto the 3D substructure. The adhesive printed onto the 3D substructure may be used to attach the 3D substructure to another substructure such as a conventionally formed substructure or another 3D printed substructure. Printing the adhesive using the 3D printer during the same 3D manufacturing process used to print the 3D substructure may improve precision of the location at which the adhesive is dispensed, thereby improving the quality of superstructure created by joining the substructures. An embodiment of the present teachings may decrease the overall time and cost to attach substructures.