Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
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Application No.: US15958262Application Date: 2018-04-20
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Publication No.: US10399335B2Publication Date: 2019-09-03
- Inventor: Hiroaki Okui , Daisuke Matsumoto
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2017-086950 20170426
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; B41J2/155
Abstract:
There are provided a head chip which ejects a liquid based on an electric signal; a first conductive path for connecting the head chip to a ground on the outside of a liquid ejecting head; and a second conductive path for connecting a shield of the head chip to the ground.
Public/Granted literature
- US20180311957A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2018-11-01
Information query
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