- Patent Title: Thermal expandability adjuster, use as thermal expandability adjuster, thermoset resin composition, insulating material, sealing material and conductive paste each containing thermoset resin composition, cured products, prepreg and member obtained by curing thermoset resin composition of prepreg, method of adjusting thermal expansion rate, and member manufactured using method of adjusting
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Application No.: US15550289Application Date: 2016-01-28
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Publication No.: US10400086B2Publication Date: 2019-09-03
- Inventor: Yousuke Ebihara , Osamu Koyama
- Applicant: AIR WATER INC.
- Applicant Address: JP Hokkaido
- Assignee: AIR WATER INC.
- Current Assignee: AIR WATER INC.
- Current Assignee Address: JP Hokkaido
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2015-043020 20150304
- International Application: PCT/JP2016/052422 WO 20160128
- International Announcement: WO2016/139989 WO 20160909
- Main IPC: C08G59/32
- IPC: C08G59/32 ; C08G59/40 ; C08G59/62 ; C08K5/3445 ; C08J5/24 ; C08G59/26 ; H01L23/14 ; C07D487/04 ; H05K1/02 ; H05K1/03 ; C08J5/18 ; H01L23/29 ; H01B1/20 ; H05K1/09
Abstract:
A thermal expandability adjuster is provided which contains a glycoluril derivative compound represented by formula (1) below. The thermal expandability adjuster can reduce the linear thermal expansion coefficient of a cured product of a thermoset resin composition used for an insulating resin layer or the like and is effective for suppressing deformation of a circuit substrate due to heating. Compounding the above thermal expandability adjuster can reduce the linear thermal expansion coefficient of a cured product obtained by curing a thermoset resin composition and it is therefore possible to provide a member that exhibits small deformation due to heat.
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