Invention Grant
- Patent Title: Wrought material comprising Cu—Al—Mn-based alloy excellent in stress corrosion resistance and use thereof
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Application No.: US14997185Application Date: 2016-01-15
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Publication No.: US10400311B2Publication Date: 2019-09-03
- Inventor: Sumio Kise , Toyonobu Tanaka , Kenji Nakamizo , Koji Ishikawa , Misato Fujii , Toshihiro Omori , Ryosuke Kainuma
- Applicant: FURUKAWA TECHNO MATERIAL CO., LTD. , FURUKAWA ELECTRIC CO., LTD. , Tohoku University
- Applicant Address: JP Hiratsuka-Shi, Kanagawa JP Tokyo JP Sendai-Shi, Miyagi
- Assignee: FURUKAWA TECHNO MATERIAL CO., LTD.,FURUKAWA ELECTRIC CO., LTD.,TOHOKU UNIVERSITY
- Current Assignee: FURUKAWA TECHNO MATERIAL CO., LTD.,FURUKAWA ELECTRIC CO., LTD.,TOHOKU UNIVERSITY
- Current Assignee Address: JP Hiratsuka-Shi, Kanagawa JP Tokyo JP Sendai-Shi, Miyagi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2013-148058 20130716
- Main IPC: G02C5/00
- IPC: G02C5/00 ; G02C5/08 ; G02C1/00 ; G02C1/08 ; G02C1/04 ; G02C1/02 ; C22C9/01 ; C22C9/05 ; C22F1/08 ; A61C7/20 ; A61L31/02 ; A61L31/14 ; A61F5/01 ; A61F5/11
Abstract:
A wrought material containing a Cu—Al—Mn-based alloy, in which an existence frequency of a coincidence grain boundary with a Σ value of 3 or less is 35% or more but 75% or less, and which has a recrystallized microstructure substantially formed from a β single phase; and the use thereof.
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