Invention Grant
- Patent Title: Ceramic housing
-
Application No.: US15516456Application Date: 2014-11-06
-
Publication No.: US10401911B2Publication Date: 2019-09-03
- Inventor: Kuan-Ting Wu , Chi Hao Chang , Cheng-Feng Liao
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HPI Patent Department
- International Application: PCT/US2014/064283 WO 20141106
- International Announcement: WO2016/072990 WO 20160512
- Main IPC: B32B3/02
- IPC: B32B3/02 ; G06F1/16 ; B29C45/14 ; C04B41/48 ; C04B41/83 ; C23C14/22 ; C23C16/44 ; H05K5/02 ; B29K709/02 ; B29L31/00
Abstract:
According to one example, a ceramic housing for an electronic device includes a surface and an elastomer, where the elastomer covers from ten percent to eighty-five percent of a total surface area of the surface.
Public/Granted literature
- US20180232012A1 CERAMIC HOUSING Public/Granted day:2018-08-16
Information query
