Invention Grant
- Patent Title: Touch sensitive processing apparatus, electronic system and method thereof for configuring interconnection parameters with touch panel
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Application No.: US15723309Application Date: 2017-10-03
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Publication No.: US10402015B2Publication Date: 2019-09-03
- Inventor: Chin-Fu Chang , Shang-Tai Yeh
- Applicant: EGALAX_EMPIA TECHNOLOGY INC.
- Applicant Address: TW Taipei
- Assignee: EGALAX_EMPIA TECHNOLOGY INC.
- Current Assignee: EGALAX_EMPIA TECHNOLOGY INC.
- Current Assignee Address: TW Taipei
- Agency: WPAT, PC
- Main IPC: G06F3/041
- IPC: G06F3/041 ; G06F3/044 ; G09G5/14 ; G06F3/14 ; G06F3/0354

Abstract:
The present application provides a touch sensitive processing method for configuring interconnection parameters between a touch panel and a touch sensitive processing apparatus in an electronic system. The method comprises: connecting, by an interconnection network of the touch sensitive processing apparatus, P first circuits of a first apparatus connector with a drive circuit of the apparatus, connecting, by the interconnection network, Q second circuits of a second apparatus interface with a detecting circuit of the apparatus, respectively; having the drive circuit emit a drive signal from at least one of first touch sensitive electrodes via the interconnection network; and detecting, via the interconnection network by the detecting circuit, that there are N consecutive second touch sensitive electrodes connected to the N consecutive second circuits among the Q second circuits.
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