Invention Grant
- Patent Title: Module auto addressing in platform bus
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Application No.: US14869608Application Date: 2015-09-29
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Publication No.: US10402358B2Publication Date: 2019-09-03
- Inventor: Ronald Sorenson , Paul Patton , Rick Solosky , Rolf L. Strand , John Evers , Patrick Springman , Yury Millman
- Applicant: Honeywell International Inc.
- Applicant Address: US NJ Morris Plains
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morris Plains
- Agency: Seager, Tufte & Wickhem LLP
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G05B19/05 ; F24D19/10 ; G06F13/42

Abstract:
A system and approach for addressing modules on a platform bus that may incorporate a master module and one or more slave modules. The platform bus may run through sub-base connectors that interlock modules together on a rail. Addressing of the modules may occur automatically and dynamically in that the master module may have a first address by default, and a first slave module adjoining the master module may be assigned a second address. A second slave module adjoining the first slave module, if there is one, may be assigned a third address. Each of the other slave modules, adjoining a preceding slave module assigned an address, may be assigned a next address after an address assigned to a preceding slave module. Addresses may be assigned in a numerical order to each module based on a physical position of the respective module on a rail.
Public/Granted literature
- US20160092388A1 MODULE AUTO ADDRESSING IN PLATFORM BUS Public/Granted day:2016-03-31
Information query