Invention Grant
- Patent Title: Method and layout of an integrated circuit
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Application No.: US15355206Application Date: 2016-11-18
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Publication No.: US10402529B2Publication Date: 2019-09-03
- Inventor: Mahantesh Hanchinal , Chi Wei Hu , Min-Yuan Tsai , Shu-Yi Ying
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G03F1/36 ; H01L21/027 ; H01L21/768

Abstract:
A method of designing a layout includes identifying a cell having a cell height being a non-integral multiple of a minimum pitch, generating, using a processor, possibilities of an ordered arrangement of a plurality of virtual grid lines parallel to the top boundary and the bottom boundary, and placing at least two conductive patterns on the plurality of virtual grid lines. The cell height is defined by a top boundary and a bottom boundary, and the minimum pitch is based on a manufacturing process. The plurality of virtual grid lines are separated from each other by a plurality of spacings, and the top boundary overlaps a first virtual grid line of the plurality of virtual grid lines and the bottom boundary overlaps a second virtual grid line of the plurality of virtual grid lines. At least one spacing is different from another spacing of the plurality of spacings.
Public/Granted literature
- US20180144082A1 METHOD AND LAYOUT OF AN INTEGRATED CIRCUIT Public/Granted day:2018-05-24
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