Invention Grant
- Patent Title: Spread weave induced skew minimization
-
Application No.: US15161074Application Date: 2016-05-20
-
Publication No.: US10402531B2Publication Date: 2019-09-03
- Inventor: Robert Bisson , Marko Antonic
- Applicant: Ciena Corporation
- Applicant Address: US MD Hanover
- Assignee: Ciena Corporation
- Current Assignee: Ciena Corporation
- Current Assignee Address: US MD Hanover
- Agency: Clements Bernard Walker PLLC
- Agent Christopher L. Bernard; Lawrence A. Baratta, Jr.
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H05K3/00 ; H05K1/02 ; H05K1/03 ; H05K1/18
Abstract:
A method of manufacturing a printed circuit board (PCB) includes determining a weft direction of the PCB, and defining a routing design of differential pairs. The routing design is designed to have a fixed region in the weft direction. The method further includes manufacturing the PCB according to the routing design.
Public/Granted literature
- US20170339780A1 SPREAD WEAVE INDUCED SKEW MINIMIZATION Public/Granted day:2017-11-23
Information query
