Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US15633236Application Date: 2017-06-26
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Publication No.: US10403433B2Publication Date: 2019-09-03
- Inventor: Woo Jin Choi
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2016-0144715 20161101
- Main IPC: H01G2/06
- IPC: H01G2/06 ; H01G4/228 ; H01G4/38 ; H01G4/232 ; H01G4/12 ; H01G4/30

Abstract:
A multilayer electronic component includes a first capacitor including a first multilayer body having a structure in which a plurality of internal electrodes and a plurality of dielectric layers are alternately stacked, a second capacitor including a second multilayer body disposed adjacent the first multilayer body, the second multilayer body connected to the first multilayer body in parallel, and the second multilayer body having a structure in which a plurality of internal electrodes and a plurality of dielectric layers are alternately stacked, a fixing member fixing the first and second multilayer bodies, a first lead terminal connected to a first end portion of the fixing member, and a second lead terminal connected to a second end portion of the fixing member.
Public/Granted literature
- US20180122578A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2018-05-03
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