Invention Grant
- Patent Title: Modular substrate heater for efficient thermal cycling
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Application No.: US14172754Application Date: 2014-02-04
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Publication No.: US10403521B2Publication Date: 2019-09-03
- Inventor: Gangadhar Sheelavant , Cariappa Achappa Baduvamanda
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: H01L21/67
- IPC: H01L21/67
Abstract:
A substrate heater for a substrate processing chamber which includes a substrate support for a substrate processing chamber which includes a body having a top plate with a substrate receiving surface, and a movable heater disposed in the body, the heater being movable relative to the top plate.
Public/Granted literature
- US20140263271A1 MODULAR SUBSTRATE HEATER FOR EFFICIENT THERMAL CYCLING Public/Granted day:2014-09-18
Information query
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