Invention Grant
- Patent Title: Electronic device packages with attenuated electromagnetic interference signals
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Application No.: US15721729Application Date: 2017-09-29
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Publication No.: US10403581B2Publication Date: 2019-09-03
- Inventor: Jaejin Lee , Hao-Han Hsu , Chung-Hao J. Chen , Dong-Ho Han
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Thorpe North & Western, LLP
- Agent David W. Osborne
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L21/48 ; H01L23/498 ; H01L21/56 ; H01L23/14 ; H01L23/31 ; H01L21/02 ; H05K1/02 ; H01L23/66 ; H01L23/00 ; H01L23/16
Abstract:
Electronic device packages utilizing a stiffener coupled to a substrate with a magnetic lossy bonding layer to attenuate or absorb electromagnetic signals such as radio frequency interference (RFI) along with related systems and method are disclosed.
Public/Granted literature
- US20190103366A1 ELECTRONIC DEVICE PACKAGES WITH ATTENUATED ELECTROMAGNETIC INTERFERENCE SIGNALS Public/Granted day:2019-04-04
Information query
IPC分类:
