Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16129554Application Date: 2018-09-12
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Publication No.: US10403727B2Publication Date: 2019-09-03
- Inventor: Tsutomu Ina , Yukihisa Ueno , Tohru Oka
- Applicant: TOYODA GOSEI CO., LTD.
- Applicant Address: JP Kiyosu-Shi, Aichi-Ken
- Assignee: TOYODA GOSEI CO., LTD.
- Current Assignee: TOYODA GOSEI CO., LTD.
- Current Assignee Address: JP Kiyosu-Shi, Aichi-Ken
- Agency: McGinn IP Law Group, PLLC.
- Priority: JP2017-187744 20170928
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/40 ; H01L29/417 ; H01L29/423 ; H01L29/06 ; H01L29/12 ; H01L29/739 ; H01L21/8234 ; H01L29/66 ; H01L29/16 ; H01L29/20

Abstract:
To provide a technique for alleviating electric field concentration at an end portion and the vicinity of the end portion of the bottom surface of a trench. In a non-active region, a semiconductor device comprises: an outer trench penetrating a third semiconductor layer and a second semiconductor layer to reach a first semiconductor layer, and surrounding an active region; a second insulating film covering the surface of the outer trench; a conductor formed in the outer trench covered by the second insulating film and electrically insulated from a control electrode and a contact electrode; and an outer electrode located outside the outer trench, contacting the second semiconductor layer, and being electrically connected to the contact electrode.
Public/Granted literature
- US20190097004A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-03-28
Information query
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