- Patent Title: Electrolytic copper foil having high tensile strength, electrode including the same, secondary battery including the same, and method of manufacturing the same
-
Application No.: US15661266Application Date: 2017-07-27
-
Publication No.: US10403898B2Publication Date: 2019-09-03
- Inventor: Seung Min Kim , Jeong Gil Lee , Shan Hua Jin
- Applicant: LS Mtron Ltd.
- Applicant Address: KR Anyang-si, Gyeonggi-Do
- Assignee: KCF TECHNOLOGIES CO., LTD.
- Current Assignee: KCF TECHNOLOGIES CO., LTD.
- Current Assignee Address: KR Anyang-si, Gyeonggi-Do
- Agency: K&L Gates LLP
- Main IPC: H01M4/66
- IPC: H01M4/66 ; C25D3/38 ; C25D5/08 ; C25D7/06 ; C25D1/04 ; H01M10/0525

Abstract:
A high strength electrolytic copper foil preventing generation of folds, wrinkles, pleats, and breaks during a roll-to-roll (RTR) process, a method of manufacturing the same, and an electrode and a secondary battery which allow high productivity to be secured by being manufactured with such an electrolytic copper foil. The electrolytic copper foil includes a copper film including 99 weight % or more of copper and a protective layer on the copper film, wherein the electrolytic copper foil has a tensile strength of 45 to 65 kgf/mm2.
Public/Granted literature
Information query