Invention Grant
- Patent Title: Connector system with thermal surface
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Application No.: US16179163Application Date: 2018-11-02
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Publication No.: US10403993B2Publication Date: 2019-09-03
- Inventor: Kent E. Regnier
- Applicant: Molex, LLC
- Applicant Address: US IL Lisle
- Assignee: Molex, LLC
- Current Assignee: Molex, LLC
- Current Assignee Address: US IL Lisle
- Agency: Molex, LLC
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01R12/72 ; H01R13/6583 ; H01R13/66 ; H01R24/30 ; H01R43/20 ; G02B6/42
Abstract:
A module can be configured to mate with a receptacle. The module includes a body with a thermal surface that is coupled to thermally active circuitry supported by the body. The receptacle is configured to allow air to flow over the thermal surface so as to dissipate thermal energy from the circuitry.
Public/Granted literature
- US20190074618A1 CONNECTOR SYSTEM WITH THERMAL SURFACE Public/Granted day:2019-03-07
Information query
