Invention Grant
- Patent Title: Coil substrate
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Application No.: US15292397Application Date: 2016-10-13
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Publication No.: US10404091B2Publication Date: 2019-09-03
- Inventor: Ki Won Chang , Hyung Wook Cho , Dong Woo Han , Si Hyung Kim , Tae Seok Yang , Choon Hee Kim , Chang Mok Han , Taek Woo Kim
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2016-0002233 20160107
- Main IPC: H02J7/02
- IPC: H02J7/02 ; H02J50/80 ; H04B5/00 ; H02J7/00 ; H02J50/10

Abstract:
A coil substrate for wireless power transmission includes: an insulating substrate including a first surface and a second surface; a first wiring portion disposed on the first surface, wherein the first wiring portion includes first spiral patterns and a section in which opposing ends of each of the first spiral patterns are disposed parallel to each other; a second wiring portion disposed on the second surface and including second spiral patterns, wherein opposing ends of each of the second spiral patterns are spaced apart from each other; and conductive vias alternately connecting the first spiral patterns and the second spiral patterns to each other to form coil turns.
Public/Granted literature
- US20170201114A1 COIL SUBSTRATE Public/Granted day:2017-07-13
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