Invention Grant
- Patent Title: Mobile device with user-operable cover for exposing thermally conductive panel
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Application No.: US15278799Application Date: 2016-09-28
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Publication No.: US10404309B2Publication Date: 2019-09-03
- Inventor: Sankarananda Basak , Joshua Een , David W. Browning
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H04M1/00
- IPC: H04M1/00 ; H04B1/3888 ; H04M1/02

Abstract:
A mobile device may include circuitry, a thermally-conductive panel in thermal communication with the circuitry, and a housing with a user-operable thermal access cover that has a closed position to cover the thermally-conductive panel and an open position to expose the thermally-conductive panel. Embodiments may include a dock with which the mobile device may be engaged, wherein the dock may include a thermal transfer device to engage the thermally-conductive panel of the mobile device.
Public/Granted literature
- US20180091183A1 MOBILE DEVICE WITH USER-OPERABLE COVER FOR EXPOSING THERMALLY CONDUCTIVE PANEL Public/Granted day:2018-03-29
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