Invention Grant
- Patent Title: Grounding circuit and grounding method
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Application No.: US16074478Application Date: 2017-02-13
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Publication No.: US10404382B2Publication Date: 2019-09-03
- Inventor: Yoshinari Takigawa
- Applicant: NEC Corporation
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2016-028066 20160217
- International Application: PCT/JP2017/005079 WO 20170213
- International Announcement: WO2017/141855 WO 20170824
- Main IPC: H02H9/02
- IPC: H02H9/02 ; H04B10/80 ; H02H9/04 ; H04B3/44 ; G01R19/165 ; H01H45/14 ; H01H47/00 ; H02H9/08

Abstract:
In order to suppress both large current and arc discharge during hot switching, a grounding circuit includes a first relay, a second relay, and a third relay, a first resistance connected in series with the first relay and is capable of connecting the feeding path to the ground, and a voltage divider connected in series with the second relay and the third relay and is connectable in such a way as to divide voltage between the feeding path and the ground, the third relay being disposed at a point at which the voltage is divided, and when the feeding path is to be connected to the ground, the feeding path is connected to the ground via the first resistance by the first relay, the voltage divider is connected in parallel with the first relay and the first resistance, and a connection to the ground is cut off.
Public/Granted literature
- US20190044621A1 GROUNDING CIRCUIT AND GROUNDING METHOD Public/Granted day:2019-02-07
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