Invention Grant
- Patent Title: Multilevel driver for high speed chip-to-chip communications
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Application No.: US16143225Application Date: 2018-09-26
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Publication No.: US10404500B2Publication Date: 2019-09-03
- Inventor: Roger Ulrich
- Applicant: Kandou Labs, S.A.
- Applicant Address: CH Lausanne
- Assignee: KANDOU LABS, S.A.
- Current Assignee: KANDOU LABS, S.A.
- Current Assignee Address: CH Lausanne
- Agency: Invention Mine LLC
- Main IPC: H04L25/03
- IPC: H04L25/03 ; H04B3/04 ; H03K19/0185 ; H03K19/00 ; H04L25/49

Abstract:
A plurality of driver slice circuits arranged in parallel having a plurality of driver slice outputs, each driver slice circuit having a digital driver input and a driver slice output, each driver slice circuit configured to generate a signal level determined by the digital driver input, and a common output node connected to the plurality of driver slice outputs and a wire of a multi-wire bus, the multi-wire bus having a characteristic transmission impedance matched to an output impedance of the plurality of driver slice circuits arranged in parallel, each driver slice circuit of the plurality of driver slice circuits having an individual output impedance that is greater than the characteristic transmission impedance of the wire of the multi-wire bus.
Public/Granted literature
- US20190028307A1 MULTILEVEL DRIVER FOR HIGH SPEED CHIP-TO-CHIP COMMUNICATIONS Public/Granted day:2019-01-24
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