Invention Grant
- Patent Title: Encapsulated payloads bonded to polymeric materials
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Application No.: US14733183Application Date: 2015-06-08
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Publication No.: US10405542B2Publication Date: 2019-09-10
- Inventor: Joseph Kuczynski , Jason T. Wertz , Jing Zhang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Busines Machines Corporation
- Current Assignee: International Busines Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Patterson + Sheridan, LLP
- Main IPC: A01N25/28
- IPC: A01N25/28 ; C11B9/00 ; C08J7/12 ; D06M23/12 ; D06M101/06
Abstract:
In an example, a polymeric material includes a fibrous substrate, a cyclic compound chemically bonded to the fibrous substrate, and a microcapsule. The microcapsule has an encapsulated payload and is reversibly bonded to the fibrous substrate via the cyclic compound.
Public/Granted literature
- US20160309710A1 ENCAPSULATED PAYLOADS BONDED TO POLYMERIC MATERIALS Public/Granted day:2016-10-27
Information query
