Invention Grant
- Patent Title: MEMS device including a capacitive pressure sensor and manufacturing process thereof
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Application No.: US15870429Application Date: 2018-01-12
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Publication No.: US10407301B2Publication Date: 2019-09-10
- Inventor: Enri Duqi , Lorenzo Baldo , Roberto Carminati
- Applicant: STMICROELECTRONICS S.R.L.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed Intellectual Property Law Group LLP
- Priority: IT102017000035969 20170331
- Main IPC: B81B3/00
- IPC: B81B3/00 ; B81C1/00 ; B81B7/02

Abstract:
MEMS device, in which a body made of semiconductor material contains a chamber, and a first column inside the chamber. A cap of semiconductor material is attached to the body and forms a first membrane, a first cavity and a first channel. The chamber is closed on the side of the cap. The first membrane, the first cavity, the first channel and the first column form a capacitive pressure sensor structure. The first membrane is arranged between the first cavity and the second face, the first channel extends between the first cavity and the first face or between the first cavity and the second face and the first column extends towards the first membrane and forms, along with the first membrane, plates of a first capacitor element.
Public/Granted literature
- US20180282152A1 MEMS DEVICE INCLUDING A CAPACITIVE PRESSURE SENSOR AND MANUFACTURING PROCESS THEREOF Public/Granted day:2018-10-04
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