The present invention relates to a packaging method for increasing the shelf life of fungal spores and to the packaging that contains such spores. The packaging method comprises the steps of pre-drying the spores to a water activity range viable for the fungus of interest, followed by packing of the spores into gas- and water-vapor-impermeable packaging by means of the use of sachets, thereby providing an atmosphere of low relative humidity and low oxygen content, followed by keeping of the spores in the packaging for a certain period of time at the temperature suitable for the spores prior to the exposure thereof to high temperatures.