Invention Grant
- Patent Title: Method for galvanic metal deposition
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Application No.: US15756755Application Date: 2016-12-01
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Publication No.: US10407788B2Publication Date: 2019-09-10
- Inventor: Ray Weinhold , Uwe Kirbach
- Applicant: Atotech Deutschland GmbH
- Applicant Address: DE Berlin
- Assignee: Atotech Deutschland GmbH
- Current Assignee: Atotech Deutschland GmbH
- Current Assignee Address: DE Berlin
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: EP15197885 20151203
- International Application: PCT/EP2016/079395 WO 20161201
- International Announcement: WO2017/093382 WO 20170608
- Main IPC: C25D5/08
- IPC: C25D5/08 ; C25D7/12 ; C25D17/00 ; C25D17/06

Abstract:
This invention concerns a method for galvanic metal deposition of a substrate using an anode and an electrolyte, wherein from each of a plurality of electrolyte nozzles a locally confined electrolyte stream is directed towards a part of a substrate surface which is to be treated, wherein a relative movement is carried out between the substrate and the electrolyte stream during deposition, characterized in that a first movement is carried out along a first path, wherein at least along a part of the first path a second movement is carried out along a second path, wherein the first and the second movement each are relative movements between the electrolyte stream and the substrate. Further, the invention concerns a substrate holder reception apparatus and an electrochemical treatment apparatus.
Public/Granted literature
- US20180265999A1 METHOD FOR GALVANIC METAL DEPOSITION Public/Granted day:2018-09-20
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