Provided here is a method for providing a coating on a plurality of substrate particles utilizing concurrent dissolution and deposition processes occurring among a plurality of source particles. Both the plurality of source particles and the plurality of substrate particles are freely immersed in the aqueous solution to form a slurry. A pH of the aqueous solution the electrochemical potential between the plurality of source particles and the aqueous solution establishes the source particles at a corrosion potential providing the concurrent dissolution and re-deposition of a cationic species on the source particles. Agitation of the slurry generates close proximity and/or brief contact between source and substrate particles causing substrate particles pass through the local environment of the source particles, resulting in some portion of the cationic species depositing at nucleation sites on the substrate particles.