Invention Grant
- Patent Title: Feedback device providing thermal feedback
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Application No.: US16083464Application Date: 2017-04-13
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Publication No.: US10408688B2Publication Date: 2019-09-10
- Inventor: Kyoung Soo Yi , Ock Kyun Oh
- Applicant: TEGWAY CO., LTD.
- Applicant Address: KR Daejeon
- Assignee: TEGWAY CO., LTD.
- Current Assignee: TEGWAY CO., LTD.
- Current Assignee Address: KR Daejeon
- Agency: Maschoff Brennan
- Priority: KR10-2016-0047503 20160419; KR10-2016-0071860 20160609
- International Application: PCT/KR2017/004032 WO 20170413
- International Announcement: WO2017/183858 WO 20171026
- Main IPC: F25B21/04
- IPC: F25B21/04 ; G01K13/00 ; G06F3/00 ; H01L35/02 ; H01L35/12 ; H01L35/34

Abstract:
Provided is a feedback device providing thermal feedback. The feedback device, according to one embodiment, may comprise a casing, a heat output module, and a feedback controller. The casing comprises: a contact part, with which a user makes contact when the feedback device moves when a content is being played; and a noncontact part with which the user does not make contact even though the feedback device moves. The heat output module comprises: flexible first and second substrates; a thermoelectric element interposed between the first the second substrates and performing a thermoelectric operation for thermal feedback; and a contact surface disposed on the second substrate. The heat output module is disposed on the curve-shaped inside or outside of the contact part, and outputs thermal feedback to the user via the second substrate and the contact surface. The feedback controller is configured so as to control the thermal output module.
Public/Granted literature
- US20190072438A1 FEEDBACK DEVICE PROVIDING THERMAL FEEDBACK Public/Granted day:2019-03-07
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