Invention Grant
- Patent Title: Interface circuit for high speed communication, and system including the same
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Application No.: US16148845Application Date: 2018-10-01
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Publication No.: US10409759B2Publication Date: 2019-09-10
- Inventor: Keun Soo Song
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2015-0099090 20150713
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/42
Abstract:
A system may include an interface circuit and a plurality of wire buses electrically coupled with one another. The interface circuit may include transmitters which change states of the plurality of wire buses to transmit a plurality of multilevel symbols. The transmitters may drive wire buses, coupled to each other, to a termination voltage level.
Public/Granted literature
- US20190034373A1 INTERFACE CIRCUIT FOR HIGH SPEED COMMUNICATION, AND SYSTEM INCLUDING THE SAME Public/Granted day:2019-01-31
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