Invention Grant
- Patent Title: Connection module
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Application No.: US16232760Application Date: 2018-12-26
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Publication No.: US10410769B2Publication Date: 2019-09-10
- Inventor: Naoki Fukushima , Osamu Nakayama , Katsushi Miyazaki , Seishi Kimura , Tetsuya Fujita
- Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Mie JP Mie JP Osaka
- Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Mie JP Mie JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2017-254092 20171228
- Main IPC: H01B17/16
- IPC: H01B17/16 ; H01R9/22 ; H01M2/20 ; H01R4/34

Abstract:
The present invention provides a connection module that allows miniaturization of a coupling structure for insulating protectors. A connection module includes a plurality of bus bars and a plurality of insulating protectors that insulate and hold the plurality of bus bars. Each of the insulating protectors includes at least one of a lock portion that includes a lock protrusion and that is provided for coupling with an adjacent insulating protector and a guide portion that guides the lock protrusion of the lock portion provided in the adjacent insulating protector such that the lock protrusion is engaged with the guide portion. The lock portion includes a guide receiving portion into which the guide portion is to be inserted, and the guide portion includes a lock engagement portion with which the lock protrusion is to be engaged.
Public/Granted literature
- US20190206593A1 CONNECTION MODULE Public/Granted day:2019-07-04
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