Invention Grant
- Patent Title: 3D TCAD simulation
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Application No.: US14699162Application Date: 2015-04-29
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Publication No.: US10410862B2Publication Date: 2019-09-10
- Inventor: Arsen Terterian , Tommaso Cilento
- Applicant: SYNOPSYS, INC.
- Applicant Address: US CA Mountain View
- Assignee: SYNOPSYS, INC.
- Current Assignee: SYNOPSYS, INC.
- Current Assignee Address: US CA Mountain View
- Agency: Haynes Beffel & Wolfeld LLP
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L21/027

Abstract:
A first representation of an integrated circuit undergoing processing is transformed into a second representation. The second representation including additional dopants relative to the first representation. The transformation generates a three-dimensional dopant distribution from adding a first dopant under a first set of process conditions with a mask, by combining the two-dimensional lateral profile of the dopant with the one-dimensional depth profile of the dopant. The one-dimensional depth profile of the dopant is retrieved from a database storing selected results from earlier process simulation of the first addition of the first dopant under the first set of process conditions. The two-dimensional lateral dopant profile from adding the first dopant under the first set of process conditions with a first mask corresponding to the first dopant, is generated by convolving the mask with a lateral diffusion function, or from at least one solution to the 2D diffusion equation without convolution.
Public/Granted literature
- US20150317420A1 3D TCAD SIMULATION Public/Granted day:2015-11-05
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