Invention Grant
- Patent Title: Confined and scalable helmet
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Application No.: US15769452Application Date: 2015-12-26
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Publication No.: US10410867B2Publication Date: 2019-09-10
- Inventor: Vyom Sharma , Rohan K. Bambery , Christopher P. Auth , Szuya S. Liao , Gaurav Thareja
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- International Application: PCT/US2015/000373 WO 20151226
- International Announcement: WO2017/111816 WO 20170629
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L29/78 ; H01L29/66 ; H01L21/8234 ; H01L27/088 ; H01L29/49

Abstract:
An embodiment includes a system comprising: a first gate and a first contact that correspond to a transistor and are on a first fin; a second gate and a second contact that correspond to a transistor and are on a second fin; an interlayer dielectric (ILD) collinear with and between the first and second contacts; wherein (a) the first and second gates are collinear and the first and second contacts are collinear; (b) the ILD includes a recess that comprises a cap layer including at least one of an oxide and a nitride. Other embodiments are described herein.
Public/Granted literature
- US20180315607A1 CONFINED AND SCALABLE HELMET Public/Granted day:2018-11-01
Information query
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