Described herein methods of manufacturing dual-sided packaged electronic modules that control the distribution of an under-fill material between one or more components and a packaging substrate. The disclosed technologies include under-filling one or more components and deflashing a portion of the under-fill to remove under-fill material prior to attaching solder balls. The deflashing step removes a thin layer of under-fill material that may have coated contact pads for the ball grid array. Because the solder balls are not present during under-fill, there is little capillary action drawing material away from the components being under-filled. This can reduce the frequency of voids under the components being under-filled. Accordingly, the disclosed technologies control under-fill for dual-sided ball grid array packages using under-fill deflash prior to attaching solder balls of the ball grid array.